超威半导体(中国)有限公司-Thermal/Mechanical Engineer

Thermal/Mechanical Engineer50-60万/年

超威半导体(中国)有限公司

上海-浦东新区  |  5-7年经验  |  本科  |  招若干人  |  06-06发布

五险一金补充医疗保险补充公积金定期体检弹性工作餐饮补贴交通补贴绩效奖金 申请职位 职位信息

Thermal/Mechanical Engineer

AMD is looking for a dynamic, self-motivated, experienced Thermal/Power Engineer to work closely with customers as well as internal development teams for AMD’s cutting-edge enterprise products. This individual will interface with the AMD internal thermal/mechanical, power/performance, package/socket, hardware development, firmware/BIOS, software tool, and systems engineering teams to assist, and address issues reported by customers. This includes training and enabling ecosystem partners with critical knowledge of AMD technologies and platforms and driving the best practices to reduce time-to-revenue, and successfully scale AMD business. The successful candidate must have comprehensive knowledge of Server/PC architecture, thermal/mechanical engineering, and relative domain knowledges. The candidate must be highly motivated, innovative, and be able to work in a fast-paced environment. He or she must be able to quickly analyze different customer scenarios to come up with the best approach to tackle tough problems.

AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology.

This is an extraordinary opportunity to work in an outstanding company like AMD - Join us!

THE ROLE:

Directly work with OEM/ODM customer thermal and mechanical design teams, providing validation support, design assistance and product trainingWork closely with ODM/OEM partners to enable successful deployment of AMD server/datacenter platforms by augmenting customer solutions with technical collateral, such as application note documentation, user guide on customization and tuning, sample and reference design materials, and debugging/profiling tools

THE PERSON:

Strong technical skills with extensive hands-on experiences in thermal/mechanical design and analysis, component and system power measurement, and system architectureStrong knowledge in the following fields: PC/Server architecture, air/liquid cooling technologies, thermal management algorithm, power management, board design, BMC, and system managementDemonstrated ability to run test, including instrumentation, data collection and analysis, and correlation with analytical resultsProficient with CFD and CAD tools such as Solidworks, Flotherm, Ansys Icepak.Team player with passion and will to do whatever it takes for business success with a keen sense of urgency and strong driveExcellent communication and evangelizing skills with an entrepreneurial spirit to drive team resultsFluent in both written and spoken English

KEY RESPONSIBILITIES:

Thermal and power measurement from component to system level for model/TTS/processor validation and correlationThermal and mechanical modeling and testing of component and systemAdvanced thermal technologies investigation. Such as vapor chamber, TIMs, liquid cooling, immersion cooling.Working knowledge of heatsink/fan design, reliability, and optimizationPerform thermal simulation and platform design reviews, as well as debugging on internal and external reference and production designs, and provide solutions to customersProvide customers technical training to improve overall customer design skillEngage directly on key technical topics, issues, architecture discussions, and performance optimizations with customers and internal teams and steer of multi-party discussion to convergenceAnalytic ability to address technical issues and generate creative solutionsOn-site support to speed up issue closure to meet overall project schedule

PREFERRED EXPERIENCE:

Good experience for thermal/power/performance optimization and data analysis.Profound experience of platform developmentExperience in working directly with global customers and enabling them to productionExperience with Linux and stress tools

ACADEMIC CREDENTIALS:

BS or MS in Physic, Mechanical or Electrical Engineering (or relative engineering fields)

LOCATION:

Shanghai/Beijing/Shenzhen, China

职能类别:高级硬件工程师

联系方式

上班地址:环科路669号凯瑞大厦

公司信息 AMD公司成立于1969年,总部位于美国加利福尼亚州桑尼维尔。AMD(NYSE: AMD)是一家创新的科技公司,致力于与客户及合作伙伴紧密合作,开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。AMD的业务遍布全球,拥有约为12000名员工。

版权声明:部分内容由互联网用户自行发布,该文仅代表作者本人观点。如有不适或侵权,请联系我们进行反馈,一经查实本站将予以删除。

给TA打赏
共{{data.count}}人
人已打赏
招聘求职

英特尔半导体(大连)有限公司-002机械(能源动力)工程师

2021-6-6 4:03:32

招聘求职

上海通用富士冷机有限公司-制冷机组产品设计工程师(全国招聘)

2021-6-6 7:26:02

关注热管理网公众号-热管理材料 reguanlicom
0 条回复 A文章作者 M管理员
    暂无讨论,说说你的看法吧
个人中心
购物车
优惠劵
今日签到
有新私信 私信列表
搜索