DP-P2000是一款高导热率且质软型缝隙填充导热垫片，由于其较软的硬度，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。操作简便，可重复利用。
DP-P2000 is a compliant thermal gap filler designed to provide moderate thermal performance. The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. DP-P2000 is easy handling and converting process and reusable special property.
半导体散热装置Semiconductors to heat sink
记忆存储模块Memory modules
LED 照明设备LED solid state lighting
台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers
LCD和等离子电视LCD and PDP flat panel TV
通讯设备Telecommunications equipment
热传导率可达2.0W/mKThermal Conductivity 2.0W/mK
高柔顺性Highly Compliant
低压力下就有较低的热阻Low thermal resistance at low pressure
便于操作，可重复利用Easy handling and converting process, reusable special property.
