DP-F3000是一款缝隙填充导热垫片，该产品的导热系数可达到3.0W/mK，并能在低压力的情况下表现出较小的热阻。同时，该产品较为柔软，可充分填充各类表面粗糙度的电子元器件。
DP-F3000 is a thermally conductive, reinforced material rated at a thermal conductivity of 3.0 W/mK, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
半导体散热装置Semiconductors to heat sink
通讯设备Telecommunications equipment
显卡Graphics cards
记忆存储模块Memory modules
照明设备LED solid state lighting LED
台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers
电源设备Power electronics
LCD和等离子电视 LCLCD and PDP flat panel TV
热传导率可达3.0 W/mKThermal Conductivity 3.0W/mK
高柔顺性Soft and highly Compliant
低压力下就有较低的热阻Low thermal resistance at low pressure
优异的自粘性能Excellent adhesive properties
